TE Connectivity and Wiwynn Showcase Liquid-Cooled 800V DC Busbar for Next-Gen AI Servers at Computex 2026

At the Computex 2026 trade show in Taipei, TE Connectivity and Wiwynn demonstrated a liquid-cooled 800V DC busbar power assembly tailored for the next generation of AI accelerators. The prototype, shown in the Wiwynn booth, illustrated how data center power distribution is evolving to meet the thermal and electrical demands of massive AI compute nodes.

The centerpiece of the demo is a TE Connectivity HVDC IT GEAR to ELCON MICRO+ Power Cable Assembly rated at 800V and 75A on the high-voltage side, stepping down to 400V at the server connector. Two dummy accelerator modules, each with a surface area exceeding 100 cm², flank the busbar assembly inside a mock server chassis.

Liquid Cooling Moves Into the Power Path

The busbar itself is liquid-cooled, a design choice that reflects the extreme power densities anticipated in AI servers. The demo server includes new liquid-cooling nozzles and connectors at the rear for rack-scale networking. Key engineering details from the Wiwynn mock-up include:

• The power cable assembly is designed as a single pre-manufactured unit that drops into the chassis, enabling robotic assembly on the production line.
• Two 100+ cm² AI accelerator dummy modules sit on either side of the power assembly, suggesting the physical footprint of future compute dies.
• The server front features a management module and four E1.S SSDs, with dummy optical network cages indicating a future network interface.
• A new liquid-cooling nozzle and connector at the rear handle both chassis cooling and rack-scale fabric connections.

Implications for Data Center Power Architecture

The shift to 800V DC distribution addresses the growing power draw of AI accelerators, which already exceed 1,000 watts per chip in some deployments. Liquid-cooling the busbar removes heat from the power delivery path, a factor that becomes critical as rack densities push past 100 kW. The solution also supports higher current carrying capacity without increasing conductor size.

Wiwynn and TE Connectivity are positioning this assembly as a manufacturable drop-in component. The entire power cable is built off the line and installed as a single piece, which reduces assembly complexity and supports the high-volume, robot-assisted manufacturing that hyperscale operators require. The next step is integrating this busbar into production servers expected in 2027 or later, depending on the pace of next-gen accelerator adoption.